surface mount adhesive is formulated to bond electrical devices or other small parts to printed circuit boards before wave soldering by Pin Transfer Method. It has following features. 貼片膠用于在針轉移法的波峰焊之前將電子元器件或其它的小型部件粘接在印刷電路板上.它具有以下特性.
l Low moisture absorption 潮氣吸收率低
l Excellent green/wet strength 極佳的未固化/濕強度
l High dot profile and resists slumping and stringing 極好的點狀外觀，抗流淌和拉絲
l Broad equipment capability with high-volume screen printing 滿足大體積絲網印刷的設備通用性
PROPERTIES OF UNCURED MATERIAL 固化前材料性能
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Property
性能
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Test Method
測試方法
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Color/Appearance 顏色/外觀
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Visual
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Viscous Red Gel 粘稠紅色凝膠
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Specific Gravity 密度, g/cc,
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ASTM D-792
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1.21
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Viscosity 粘度, (cP), 25℃
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ASTM D-2393
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~20,000
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Yield strength 屈服強度, cone & Plate, Pa, 25°C
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200-300
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TYPICAL PROPERTIES OF CURED MATERIAL 固化后材料典型物理性能
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Property 性能
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Test Method 測試方法
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Value 數值
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Coefficient of thermal expansion 熱膨脹系數, CTE
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ASTM D696
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140 E-06
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Thermal conductivity 熱導率, w/m-k
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ASTM C177
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0.4
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Lap shear strength 搭接剪切強度, steel 鋼, Mpa
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28
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Torque strength 扭轉強度, FR4 PCB, N.mm
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50 - 80
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Volume resistivity 體電阻系數, ohms-cm
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ASTM D-257
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2.1 E+15
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Surface resistivity 表面電阻系數, ohms
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ASTM D-257
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2.0 E+15
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Dielectric constant 電介質常數
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ASTM D150
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3.7(1 kHz), 3.6(10 kHz)
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Torque retention 30 seconds @100°C + 3 seconds @260°C flux and wave solder 波峰焊中30秒 @100°C + 3秒@260°C的扭力保持
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100 %
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Hot solder dip @ 260°C 熱浸焊@ 260°C
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Pass 通過
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DIRECTIONS FOR USE 使用方法
Typical curing condition 典型固化條件: 3 min. at 150 ºC 在150 ºC下保持3分鐘
Curing starts above 100 ºC, with a DSC conversion of 90%, 5 min. at 125 ºC. 固化開始于100 ºC以上, 在125 ºC保溫5分鐘, 熱轉換為90%.
CLEANING 清除
Uncured adhesive can be easily removed from printed circuit boards using isopropyl alcohol(IPA) or MEK. 未固化膠粘劑可被輕易從印刷電路板上用異丙醇或丁酮清除
Uncured adhesive can be easily removed from printed circuit boards using isopropyl alcohol(IPA) or MEK. 未固化膠粘劑可被輕易從印刷電路板上用異丙醇或丁酮清除
STORAGE INFORMATION 保存方法
在5 ºC下密封干燥儲存, 保質期為6個月
