Epoxy structural adhesive 1008A / B

I. Introduction:
 
1008A / B system solvent-free liquid at room temperature fast curing epoxy adhesive, after curing adhesive strength, low shrinkage, good flexibility of cured, has excellent electrical performance and resistance to oscillation. Electronic components can be used as general purpose adhesive.
 
Second, the conventional performance:
 
Testing methods or conditions of test items 1008A 1008B
 
Appearance dark brown head test
 
Density 25 ℃ g/cm3 1.1 ~ 1.3 1.1 ~ 1.3
 
Viscosity 25 ℃ mpa · s 15000 ~ 25000 15000 ~ 25000
 
Flash point ℃ 170 150
 
Ventilation from year to year shelf life at room temperature
 
Third, the use of technology:
 
Item Unit or conditions 1008A/1008B
 
Mixing weight ratio of 100:100 ratio
 
Use the time 100g, 25 ℃, 15 minutes
 
Curing conditions ℃ / hrs 25/12 or 60/1.5
 
Fourth, use:
 
1008A / B can be used as general-purpose adhesive for electronic components.
 
Fifth, after curing characteristics:
 
Project unit or conditions 1008A/1008B
 
Volume resistivity 25 ℃, Ω · cm 4.3 × 1014
 
Surface resistivity 25 ℃, Ω 1.2 × 1014
 
Dielectric strength 25 ℃, kV / mm> 18
 
Shear strength kgf/mm2> 200
 
Tensile strength kgf/mm2> 130
 
Impact strength kgf/mm2> 32
 
Elongation% 100
 
VI, storage, transportation and precautions:
 
1. Such products of non-dangerous goods, as a general chemical storage and transportation, storage period, see drum.
 
2. Please use the sights of the product model, then the condemnation; accurate weighing, please, stir; weighing more than 100 grams, the use period will be shortened.
 
3. Surface of items to be stuck with chemical solvents (acetone, etc.) cleaned, especially the smooth surface of the material can play the best hair treatment to improve the bonding strength.
 
4. Unused plastic, to seal tightly to prevent moisture entry, affect the results.